Our equipment (COB)

Our production lines are fitted with automatic machines for COB (chip on board) installation which include the following:

Unsoldering machines for semiconductor chips AB559A with the capacity of 8 welding spots per second – 3 pcs.;
Unsoldering machines for semiconductor chips ЭМ-4480 with the capacity of 4 welding spots per second – 4 pcs.;
Machines for placement of chips ЭМ-4085 – 1 pc.;
Pressurizing machines for unsoldered modules ЭМ-УГ1 – 2 pcs.;


Automatic bonder ASM-559A	Automatic bonders ASM-559A	Picture of unsoldered semiconductor chip. Magnification X600.

On board placement of semiconductor chips. ЭМ-4085 machine.	On board placement of semiconductor chips. ЭМ-4085 machine.	On board placement of semiconductor chips. ЭМ-4085 machine.

On board unsoldering of semiconductor chips. ЭМ-4480 machine: view of unsoldering head.	On board unsoldering of semiconductor chips. ЭМ-4480 machine	On board unsoldering of semiconductor chips. ЭМ-4480 machine

On board pressurization of unsoldered chips. УГ-1 machine	On board pressurization of unsoldered chips. УГ-1 machine	Pressurized PCBs in accompanying container.

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